Ch-technology PowIRtab Mounting Guidelines Manuel d'utilisateur télécharger pdf

PowIRtab Mounting Guidelines

by Paul Westmarland & Pamela Dugdale

1.0 Introduction

The PowIRtab

package has been designed to fill the

gap in the market between the TO-247, more expensive

metal case devices & non-isolated power modules. It is

the natural replacement for metal case outlines such as

DO-4 & DO-5, but it is also suitable for new innovative

solutions, thanks to a package outline that combines low

profile, excellent die to footprint ratio & sturdy

connectivity. It utilises a large lead for high current

connection, carrying both a mounting hole & PCB

insertion pins. The body is compatible with a T0-218

outline, with an exposed heatsink & non-isolated mounting

hole.

It is anticipated that the devices would find typical

applications in busbar assemblies or finned heatsinks,

reducing component count & cost of ownership.

2.0 Scope

This application note covers the various fixment methods

that are possible with this device, & the associated thermal

properties resulting from their use:

a) Optimum mounting torque.

b) Type of fixings.

c) Effect of torque on thermal resistance (‘wet’ & ‘dry’).

d) Effect of pressure on contact thermal resistance (‘wet’

& ‘dry’).

3.0 Mechanical Considerations

3.1 Type of Fixings

The PowIRtab

possesses mounting holes in the tab &

lead for electrically connecting the device to heatsinks or

busbars. The lead also carries PCB insertion pins so that

the lead end may be soldered into a board.

Tab (Header)

Lead

PCB insertion

pins

Stress relief slots

Figure 1

3.2 Tab Connection

Using the mounting hole in the tab allows a designer to

attach the PowIRtab

to a heatsink. The tab of a

PowIRtab

acts as one of the terminals. There is no

common additional lead, so the mounting hole contact

must be very good, with the heatsink forming part of the

circuit. For the best results the surface of the heatsink must

AN-1010

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Résumé du contenu

Page 1 - PowIRtab Mounting Guidelines

PowIRtab Mounting Guidelinesby Paul Westmarland & Pamela Dugdale1.0 Introduction The PowIRtabTM package has been designed to fill thegap in the

Page 2 - Application Note

Application Note3.3 Clip mounting If desired, use may be made of a clip to attach thepackage to a heatsink. The recommended point for theplacement o

Page 3

Application NoteAnother solution is a laminated busbar, as supplied by theRogers Mektron Busbar Division. Here a single busbar isstamped to the step h

Page 4 - 4.0 Thermal Considerations

Application Note4.0 Thermal Considerations One of the major considerations when mounting allpower semiconductor packages is the dissipation of heat.

Page 5 - 3Nm (2.2 lbf ft)

Application Note4.2 Contact Thermal resistance as a Function of ForceAbove the Die (Clip Mounting).00.20.40.60.811.21.41.60 50 100 150 200 250 300Forc

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Ch-technology PowIRtab Mounting Guidelines Manuel d'utilisateur

Naviguer en ligne ou télécharger Manuel d'utilisateur pour Matériel Ch-technology PowIRtab Mounting Guidelines. C&H Technology PowIRtab Mounting Guidelines User Manual Manuel d'utilisatio

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